Intel LGA 2066 ATX motherboard with DDR4 4133MHz, dual M.2 and M.2 heatsink, U.2, USB 3.1 Gen 2 connectors, ASMB9-iKVM and ASUS Control Center.
ASUS Control Center: A software utility that provides convenient, secure and cost-saving centralized IT management for small and medium businesses.
ASMB9-iKVM (BMC): supports remote BIOS updates, fans control, standalone KVM, video recording, and BSOD capture, providing around-the-clock remote monitoring and diagnostics through remote console (Web GUI & CLI)
Ultra-efficient VRM heatsink: Metal fin array connected to large surface area via a heatpipe tames X299 thermals to enable unthrottled performance.
Next-gen transfer speeds: Up to 32Gbps dual M.2 and U.2, plus up to 10Gbps USB 3.1 Type-A and Type-C connections.
ASUS Control Center (ACC) is a centralized and integrated IT management platform for monitoring and controlling ASUS commercial products, including servers, workstations and digital signage. ACC enables remote BIOS updates, monitoring of multiple systems via mobile devices, and one-click software updates and dispatching, allowing easier server management for any IT infrastructure.
Make your memory go faster
With optimized trace paths for time-aligned signaling and minimal crosstalk, third-generation ASUS T-Topology offers enhanced memory stability and compatibility, allowing support for memory speeds of DDR4-4133MHz and beyond.
OC Design – ASUS PRO Clock II Technology
WS X299 PRO/SE includes a dedicated base-clock (BCLK) generator that extends CPU and memory overclocking margins. This custom solution works in tandem with the TPU to enhance voltage and BCLK overclocking control, providing the flexibility to extract every ounce of performance from the Intel® Core™ X-series processors.
Multi-GPU support
With support for both NVIDIA® SLI™ and AMD CrossFireX™ 2/3-WAY configurations, WS X299 PRO/SE enables multi-GPU setups so you can harness the full power of the latest graphics technologies to drive games at 4K and beyond.
Ultra-efficient VRM Heatsink
Designed for the powerful Intel Core X-series processor with up to 18 cores, WS X299 PRO/SE features a capable thermal design to ensure maximum performance with no CPU throttling. Consisting of an ultra-efficient VRM heatsink with a metal fin array design that maximizes surface area for heat dissipation, plus two additional heatsinks and a connecting heatpipe to further increase cooling performance, this innovative thermal design ensures WS X299 PRO/SE is always ready to handle any task, no matter how demanding.
Dual Onboard M.2 & M.2 heatsink
Perfected cooling for unleashed performance
WS X299 PRO/SE features dual onboard M.2 slots, each operating at X4 PCI Express 3.0 to provide an abundant 32Gbps of bandwidth. Both slots sit below the X299 chipset and are covered by a heatsink that reduces drive temps by as much as 20°C, ensuring peak performance under all scenarios.
U.2 connector
Join the NVMe revolution
The revolutionary specification that lets your SSDs scream at top speed. Simply attach your choice of drive and experience data-transfer speeds of up to 32Gbps — and free up a PCIe slot for another expansion card.
USB 3.1 Gen 2 front-panel connector
Future-proof connectivity
WS X299 PRO/SE's front panel USB 3.1 connector is ready for next-gen PC cases and devices.
USB 3.1 Gen 2 Type-A & Type-C
Ultimate-speed 10Gbps with USB 3.1 onboard
With backward-compatible USB 3.1 Gen 2 Type-A™ and reversible USB 3.1 Gen 2 Type-C™ ports, you'll experience ultimate connection flexibility and blazing data-transfer speeds of up to 10Gbps.
Dual Intel® server-class Gigabit LAN
For more reliable networking, WS X299 PRO/SE features the latest server-class dual Intel® Gigabit LAN ensuring lower CPU utilization and temperatures outstanding performance as well as better support for diverse operating systems. The dual Ethernet ports also support teaming which combines the network links to provide higher throughput or redundancy in case of failure.
Technical Details
Brand : ASUS
Model : WS X299 PRO/SE
Tech Specs
CPU
Build in Intel® Socket 2066 Core™ X-Series Processors
Chipset
Build in Intel® X299
Memory
Intel® Core™ X-series Processors (6-core above)
8 x DIMM, Max. 256GB, DDR4 4133(O.C.)/4000(O.C.)/3600(O.C.)/2933/2666/2400 MHz Non-ECC, Un-buffered Memory
Intel® Core™ X-series Processors (4-core)
4 x DIMM, Max. 64GB, DDR4 4133(O.C.)/4000(O.C.)/3600(O.C.)/2666/2400 MHz Non-ECC, Un-buffered Memory
* Hyper DIMM support is subject to the physical characteristics of individual CPUs.
* Please refer to ASUS AVL for the latest update.
* Actual memory frequency differs from Intel CPU types and memory module. Please check Intel official site for more detail about the memory types supported by each CPU.
* Only on Select SKUs, With 1 DIMM per channel. Additional DIMM loading on any channel may impact maximum memory speed by one bin.
Graphic
ASPEED AST2500 64MB
VGA output support : Header port
Multi-GPU Support
Supports NVIDIA® 3-Way SLI™ Technology *
Supports AMD 3-Way CrossFireX™ Technology *
Expansion Slots
48-Lane CPU-
2 x PCIe 3.0 x16 (x16 mode)
1 x PCIe 3.0 x16 (x8 mode)
1 x PCIe 3.0 x16 (x4 mode)
1 x PCIe 3.0 x4 (x4 mode)
44-Lane CPU-
2 x PCIe 3.0 x16 (x16 mode)
1 x PCIe 3.0 x16 (x8 mode)
1 x PCIe 3.0 x16 (x4 mode)
1 x PCIe 3.0 x4 (x4 mode)
28-Lane CPU-
1 x PCIe 3.0 x16 (x16 mode)
1 x PCIe 3.0 x16 (x8 mode)
1 x PCIe 3.0 x16 (x4 mode)
1 x PCIe 3.0 x4 (x4 mode)
16-Lane CPU-
1 x PCIe 3.0 x16 (x8 mode)
2 x PCIe 3.0 x16 (x4 mode)
1 x PCIe 3.0 x4 (x4 mode)
Storage
Intel® X299 Chipset :
1 x M.2 Socket 3, with M key, type 2242/2260/2280/22110 storage devices support (PCIE 3.0 x 4 mode)*1
1 x M.2 Socket 3, with M key, type 2242/2260/2280 storage devices support (both SATA & PCIE mode)*2
1 x U.2 connector
6 x SATA 6Gb/s port(s)
Support Raid 0, 1, 5, 10
Support Intel® Rapid Storage Technology enterprise 5.1 for X-Series(6-core and above) CPU RAID
Supports Intel® Smart Response Technology
Intel® Rapid Storage Technology 15 support
Intel® Optane™ Memory Ready
LAN
Intel® I210-AT, 2 x Gigabit LAN Controller(s)
Audio
Realtek® ALC S1220A 7.1-Channel High Definition Audio CODEC featuring Crystal Sound 3
- Impedance sense for front and rear headphone outputs
- Internal audio Amplifier to enhance the highest quality sound for headphone and speakers
- Supports : Jack-detection, Multi-streaming, Front Panel MIC Jack-retasking
- High quality 120 dB SNR stereo playback output (Line-out at rear) and 113 dB (Line-in)
Audio Feature :
- DTS Connect
- DTS Headphone:X
- Audio amplifier: Provides the highest-quality sound for headphone and speakers
- Premium Japanese-made audio capacitors: Provide warm, natural and immersive sound with exceptional clarity and fidelity
- Unique de-pop circuit: Reduces start-up popping noise to audio outputs
Separate layer for left and right track, ensuring both sound deliver equal quality
USB Ports
Intel® X299 Chipset :
6 x USB 3.1 Gen 1 port(s) (4 at back panel, , 2 at mid-board)
Intel® X299 Chipset :
6 x USB 2.0 port(s) (4 at back panel, , 2 at mid-board)
ASMedia® USB 3.1 Gen 2 controller :
3 x USB 3.1 Gen 2 port(s) (2 at back panel, , Type-A + USB Type-CTM, 1 at mid-board)
Workstation Feature
ASUS Control Center (ACC)
ASMB9-iKVM for KVM-over-Internet
Special Features
OC Design - ASUS PRO Clock II Technology
ASUS 5X Protection :
- ASUS Enhanced DRAM Overcurrent Protection - Short circuit damage prevention
- ASUS ESD Guards - Enhanced ESD protection
- ASUS Stainless Steel Back I/O - 3x more durable corrosion-resistant coating
ASUS EPU :
- EPU
ASUS Digital Power Design :
- Industry leading Digital 8 Phase CPU Power Design
- Industry leading Digital 2 Phase DRAM Power Design
AURA :
- Aura RGB Strip Headers
- Aura Addressable Strip Header(s)
ASUS Exclusive Features :
- Ai Charger+
- Turbo LAN
- Crystal Sound 3
ASUS Quiet Thermal Solution :
- Stylish Fanless Design with M.2 Heat-sink solution
ASUS Q-Design :
- ASUS Q-Shield
- ASUS Q-Code
- ASUS Q-LED (CPU, DRAM, VGA, Boot Device LED)
- ASUS Q-Slot
- ASUS Q-DIMM
- ASUS Q-Connector
M.2 and U.2 Onboard (The Latest Transfer Technology with up to 32Gb/s Data-transfer Speeds for M.2 and U.2)
Asus Control Center (ACC) IT management software supported
Back I/O Ports
2 x LAN (RJ45) port(s)
2 x USB 3.1 Gen 2 ()Type-A + USB Type-CTM
4 x USB 3.1 Gen 1
4 x USB 2.0
1 x Optical S/PDIF out
1 x USB BIOS Flashback® Button(s)
1 x 8-channel Audio I/O
Internal I/O Ports
1 x Aura Addressable Strip Header(s)
1 x U.2 port
1 x Aura RGB Strip Header
1 x USB 3.1 Gen 1(up to 5Gbps) connector(s) support(s) additional 2 USB 3.1 Gen 1 port(s)
1 x USB 2.0 connector(s) support(s) additional 2 USB 2.0 port(s)
1 x M.2 Socket 3 with M key, type 2242/2260/2280/22110 storage devices support (PCIE 3.0 x 4 mode)
1 x M.2 Socket 3 with M Key, type 2242/2260/2280 storage devices support (SATA mode & X4 PCIE mode)
1 x TPM header
1 x COM port(s) connector(s)
6 x SATA 6Gb/s connector(s)
1 x VROC_HW_Key
1 x Thunderbolt header(s)
1 x 24-pin EATX Power connector(s)
1 x 6-pin ATX Power connector
2 x 8-pin ATX 12V Power connector(s)
1 x EZ XMP switch
1 x VGA connector(s)
1 x AUX panel header(s)
1 x 5-pin EXT_FAN(Extension Fan) connector
1 x Power-on button(s)
1 x Reset button(s)
1 x Clear CMOS button(s)
1 x Front fan
1 x Rear fan
1 x U.2 Connector (support U.2 NVMe device)
1 x AIO PUMP Header
1 x Thermal sensor connector
1 x CPU_OV jumper
1 x MemOK! Button
1 x PANEL2
1 x PUMP Fan connector
1 x PANEL1
Accessories
User´s manual
1 x Vertical M.2 bracket set
I/O Shield
1 x COM port cable(s)
6 x SATA 6Gb/s cable(s)
2 x M.2 screws
1 x Supporting DVD
1 x 3-Way SLI bridge(s)
1 x SLI bridge(s)
1 x Q-Connector
1 x 2-port USB module(s)
1 x Extension Cable for RGB strips (80 cm)
Form Factor
ATX Form Factor
12 inch x 9.6 inch ( 30.5 cm x 24.4 cm )
Weight
Gift Box(3-in-1)
Net Weight: 4.59 Kg
Gross Weight: 7.48 Kg
Bulk Pack(5-in-1)
Net Weight: 7.15 Kg
Gross Weight: 8.94 Kg
